Call Us Now! +86-551-63853683 Sales@climatechambers.com
You are here:Home >> Support >> Latest News

Support

Support

Contact Us

Symor Instrument Equipment Co.,Ltd
Email: Sales@climatechambers.com
Tel: +86-551-63853683, 68663630
Shanghai office 
No.3215,Huhang Highway,Fengxian District, Shanghai, 231417,China
Hefei office
No.105 Dayang Industrial Park
Luyang District, Hefei, 230041, China

Latest News

What are the methods for semiconductor packaging? 2/2

What are the methods for semiconductor packaging? Follow us today to know more:

1LGA

That is land grid array abbreviation, called contact display package, is named for making array state electrode contacts on the bottom. Mainly used in high-speed logic LSI circuit. The characteristic is that the smaller package can accommodate more input and output pins, and the impedance of the lead is small. But because its cost is higher and socket production is more complex, so now use less. But with the progress of manufacturing technology, the market of this packaging form will increase.

2H-(with heat sink)

The H is used to indicate the mark with the radiator, for example HSOP, the SOP, package with the radiator is generally better.

3BGA

Spherical contact display, is one of the surface mount packaging forms. Because it makes spherical convex points on the back of the printed substrate to replace the pin, assembles the LSI chip on the front of the printed substrate, and then seals it by moulding resin or filling method, which is also called the land display carrier. A multi-pin LSI package with pins exceeding 200.

  • Previous:What is dust test chamber?  2021/12/24
  • Next:How to prolong the service life of drying oven?  2020/11/25
  • Copyright © 2001-2021 Symor Instrument Equipment Co., Ltd. All Rights Reserved